product details dimension a dimension b dimension c dimension d interface material finish notes: d imension c = heat sink height from bottom of the base to the top of the fn feld. ats-51325k-c1-r0 is a subsitute item available utilizing an equivalent phase change material (chomerics t766). thermal performance data are provided for reference only. actual performance may vary by application. ats reserves the right to update or change its products without notice to improve the design or performance. optional maxigrip? installation/removal tool set p/n: mgt325 contact ats to learn about custom options available. 1) 2) 3) 4) 5) 6) t hermal performance for more information, to fnd a distributor or to place an order, visit www.qats.com or call: 781.769.2800 (north america); +31 (0) 3569 84715 (europe). ats part # ATS-51325K-C2-R0 features & benefts ultra high performance bga cooling solutions w/ maxigrip? attachment rev1_0908 air velocity thermal r esistance ft/min m/s c/w (unducted flow) c/w (ducted flow) 200 1.0 300 1.5 400 2.0 500 2.5 600 3.0 700 3.5 800 4.0 3.5 2.8 2.4 2.1 2 1.8 1.7 2.6 32.5 mm 32.5 mm 14.5 mm 57.5 mm black- anodized saint -gobain c1100f maxiflow? design features a low profile, spread fin array that maximizes surface area for more effective convection (air) cooling maxigrip? attachment applies steady, even pressure to the component and does not require holes in the pcb meets telcordia gr-63-core office vibration; etsi 300 019 transportation vibration; and mil-std-810 shock and unpackaged drop testing standards comes preassembled with high performance, phase changing, thermal interface material designed for low profile components from 1.5 to 2.99mm ? ? ? ? ? c d a b *image above is for illustration purposes only.
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